Taisn Two Component Silicone Potting Compound, Mix Ratio is A:B=1:1
Product features:
1, After mixing, the potting compound resting period is long, and curing time can be fast if with heat treatment, so it’s very good to be used in automatic production line.
2, This product has good high temperature resistance and ageing resistance. It can keep good elastic and insulation performance after curing from -60～250℃.
3,The compound won’t shrink when curing, it has excellent ageing resistance and water-proof.
4, It has good thermal conductivity and flame retardancy. Flame resistance can reach UL94-V1.
Product application:
This product is designed for potting and protecting high power electronic components, module power supply and PCB which request good heat dissipation and high temperature resistance. For example, automobile HID lamp module power supply, automotive ignition system module power supply, solar panels, transformer and sensor etc.
Technical Data Sheet:
Before curing | Appearance | White（A）/White（B）liquid |
Viscosity（cps，25℃） | 3000～5000 | |
Mix ratio | A ：B = 1 ：1 | |
Viscosity after mixing （cps） | 2500～4500 | |
Operational time（min，25℃） | 40 | |
Curing time（min，25℃） | 360 | |
Initial curing time（min，25℃） | 120 | |
After curing | Hardness (shore A) | 40±5 |
Thermal conductivity [ W（m·K）] | ≥0.8 | |
Dielectric strength（kV/mm） | ≥27 | |
Dielectric constant（1.2MHz） | 3.0～3.3 | |
Volume resistivity （Ω·cm） | ≥1.0×1016 | |
Coefficient of linear expansion [m/（m·K）] | ≤2.2×10-4 | |
Flame resistance | 94-V1 | |
Waterproof grade | ≥IP67 |
How to use:
1): Mix two parts in a container by ratio of A: B=1:1, then stir two parts uniformly.
2): Pour the mixed compound to the parts to be potting. Normally it doesn’t need vacuum defoaming. If need get high thermal conductivity, we suggest to use vacuum defoaming before potting. The potting compound can cure at room temperature or thermal curing. Curing speed is related to temperature, it need long time to cure in winter, then we suggest to use thermal curing. At 80℃ the curing time is only 10-20 minutes, at room temperature curing time is 6-8 hours.
Attention:
The potting compound should be stored in sealed condition. Use up the mixed compound one time to avoid wasting.
This product is non-toxic, but avoid swallow or contact eyes.
After long storage, the potting compound additive will subside, then stir them uniformly before using, and it won’t affect the performance.
Note, the potting compound will not cure if contact with below chemical substances:
1: N, P, S organic compound
2: Sn, Pb, Hg, As plasma compounds
3: Alkynes and polyvinyl compounds
Taisn Two Component Silicone Potting Compound, Mix Ratio is A:B=1:1
Product features:
1, After mixing, the potting compound resting period is long, and curing time can be fast if with heat treatment, so it’s very good to be used in automatic production line.
2, This product has good high temperature resistance and ageing resistance. It can keep good elastic and insulation performance after curing from -60～250℃.
3,The compound won’t shrink when curing, it has excellent ageing resistance and water-proof.
4, It has good thermal conductivity and flame retardancy. Flame resistance can reach UL94-V1.
Product application:
This product is designed for potting and protecting high power electronic components, module power supply and PCB which request good heat dissipation and high temperature resistance. For example, automobile HID lamp module power supply, automotive ignition system module power supply, solar panels, transformer and sensor etc.
Technical Data Sheet:
Before curing | Appearance | White（A）/White（B）liquid |
Viscosity（cps，25℃） | 3000～5000 | |
Mix ratio | A ：B = 1 ：1 | |
Viscosity after mixing （cps） | 2500～4500 | |
Operational time（min，25℃） | 40 | |
Curing time（min，25℃） | 360 | |
Initial curing time（min，25℃） | 120 | |
After curing | Hardness (shore A) | 40±5 |
Thermal conductivity [ W（m·K）] | ≥0.8 | |
Dielectric strength（kV/mm） | ≥27 | |
Dielectric constant（1.2MHz） | 3.0～3.3 | |
Volume resistivity （Ω·cm） | ≥1.0×1016 | |
Coefficient of linear expansion [m/（m·K）] | ≤2.2×10-4 | |
Flame resistance | 94-V1 | |
Waterproof grade | ≥IP67 |
How to use:
1): Mix two parts in a container by ratio of A: B=1:1, then stir two parts uniformly.
2): Pour the mixed compound to the parts to be potting. Normally it doesn’t need vacuum defoaming. If need get high thermal conductivity, we suggest to use vacuum defoaming before potting. The potting compound can cure at room temperature or thermal curing. Curing speed is related to temperature, it need long time to cure in winter, then we suggest to use thermal curing. At 80℃ the curing time is only 10-20 minutes, at room temperature curing time is 6-8 hours.
Attention:
The potting compound should be stored in sealed condition. Use up the mixed compound one time to avoid wasting.
This product is non-toxic, but avoid swallow or contact eyes.
After long storage, the potting compound additive will subside, then stir them uniformly before using, and it won’t affect the performance.
Note, the potting compound will not cure if contact with below chemical substances:
1: N, P, S organic compound
2: Sn, Pb, Hg, As plasma compounds
3: Alkynes and polyvinyl compounds